France

Electronics is increasingly introduced in our society and the Internet-of-Things (IoT) contribute extensively to this trend. Indeed, their number is expected to boom in the next years (+10-30% per year). Although this could enable positive effects both on our society and our environment through optimization and monitoring, the massive deployment of IoT will come together with an undeniable environmental burden which is often overlooked. As it has been shown that the main environmental impacts of electronics do not reside necessary in the use phase but rather in the raw-material extraction and production phases (which is especially true for battery-powered devices), life cycle approaches are needed to better understand the impacts of the IoT in order to avoid worsening the current environmental situation.
In this talk, we first present a macroscopic analysis focusing mainly on the energy and carbon footprint of ICT sub-sectors. It shows that the following of exponential trends such as Moore’s law will very unlikely lead to an absolute decrease of GHG emissions if sobriety is not considered together with efficiency improvements. Then, we propose a framework based on hardware profiles to explore the environmental impacts of the production of IoT edge devices and discuss the coherence of the expected massive IoT deployment with respect to the Paris Agreement objectives. We also present eco-design use cases for IoT devices that are being developed in our labs, focusing on the environmental impacts of microelectronics pressure sensors and water quality monitoring applications. In order to showcase how LCA can be used to support the development of new eco-design guidelines in the electronics sector, we study the interest of new design paradigms such as hybrid electronics. Finally, we call engineers to integrate systemic considerations when developing technologies, and we offer some concrete perspectives and tools that can be applied by engineers to support the dissemination of more sustainable and appropriate electronics.

ESSCIRC ESSDERC Educational Events

Towards a Green and Sustainable Digital Infrastructure: challenges and opportunities

micro/nano electronics

greet iot nodes

circular economy

edge ai

sustainability

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
The level of integration for system-on-chip design is rapidly increasing.

This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers, and system designers is necessary. ESSCIRC and ESSDERC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both device and circuit communities.

Highlights:
* 3 joint keynote presentations
* 3 keynote presentations ESSCIRC
* 3 keynote presentations ESSDERC
* Invited papers with overall coverage of all aspects of advanced devices and circuits
* Presentation of IEEE and ESSCIRC/ESSDERC Awards
* Educational Events

JOINT PLENARY talks live broadcast: September 13, 2021<br>
ESSCIRC and ESSDERC KEYNOTE talks live broadcast: September 15, 2021<br>
LIVE Q&A INTERACTIVE sessions for all Conference Technical sessions: September 14 – 16 – 17, 2021<br>
LIVE Q&A INTERACTIVE sessions for all Educational Events: September 20-21-22, 2021<br>
(on demand videos available from September 6 until November 30, 2021)

**Please see here for the [ESSCIRC Guide](https://drive.google.com/file/d/10dghzuv4aQBty4QfTIY9Q8hXyqsue8Le/view?usp=sharing), [ESSDERC Guide](https://drive.google.com/file/d/10dx9y2tm9cHPDa4upNUYjfXCf44aPry5/view?usp=sharing), and the [Program at a Glance](https://drive.google.com/file/d/10eU0OLTXEpiNzI5hkqv4mSr43T8cedPP/view?usp=sharing)**

Please register for educational events at the following link: https://www.registerme.eu/event/esscirc-essderc-2021/

Please register for the ESSCIRC/ESSDERC Educational Events to join the event.

The Educational Events of ESSCIRC ESSDERC 2021. 

technical paper

Advances in process and fabrication enable the relentless downscaling into the nanometer regime and open the way to a new era of device structures and materials. Approaching the atomic scale, individual imperfections such as point defects, which are inevitably present in bulk and interface systems, and their distributed properties start to become a decisive factor for device reliability and start to dominate the device performance. Keeping pace with the technological progress on the theoretical simulation side, hence, requires reliable approaches based on fundamental physics such as ab initio calculations. Largely driven by the beat of Moore’s law itself and the increase of computational resources, atomistic first-principles calculations are routinely used nowadays to predict structural and electronic properties. Nevertheless, understanding the underlying model together with a careful analysis of the results is essential to draw meaningful conclusions. Particularly in the field of device reliability, these advancements have enabled an improved understanding of intrinsic and extrinsic point defects in various materials such as Si/SiO2/HfO2 or SiC/SiO2 stacks. Due to the predictive power and accuracy of density-functional-based calculations characteristic defect properties such as thermodynamic and optical transition levels as well as their interaction with the surrounding can be directly connected to experimental observations. Hence, it is possible to assess how vacancy, interstitial, antisite, substitutional, and other defect types impact and perturb the device performance. Moreover, these results provide vital input for the development of modern predictive TCAD models.

Modeling of Bulk and Interface Defects for Reliability Prediction on the Atomistic Scale.

The current electronic device scaling is reduced to 5 nm and smaller technology nodes based on EUV lithography, it is expected to reach sub-nm technology node within a decade. Along with the EUV scaling, the space of medium/upper level BEOL provides both challenges and opportunities to device research community. Rational design of device materials using atomic scaling modeling methods can contribute the accelerated development of the new technology materials based on fundamental understanding on their atomic and electronic scale properties. Using the density functional theory (DFT), atomistic kinetic Monte Carlo (KMC) and time-dependent DFT (TDDFT) simulations methods, we have been investigating the BEOL process compatible oxide semiconductors for monolithic 3 dimensional (M3D) integration of functional devices in the intermediate interconnect layers. In this tutorial, we will discuss about the multiscale modeling approaches applied to device materials modeling for n- and p-type oxide semiconductor design for BEOL applications. We will examine atomic and electronic structures of both n-type and p-type oxide semiconductors in crystalline and amorphous phases. Using the rational design approach to oxide semiconductors based on DFT calculations, we are exploring the complex oxide material parameter space and charting possible pathways to develop both p-type and n-type oxide semiconductor candidates for BEOL CMOS applications. We will discuss the design rationales of currently identified oxide semiconductor candidates (Ta2SnO6, TiSnO3 for p-type In-W-O system for n-type) and validation experiments to accelerate the focused development of BEOL oxide semiconductors with superior performance. These oxide semiconductors will provide case study examples of the materials deign method applied to electronic device materials in this tutorial. 
This work was supported by ASCENT, one of six centers in JUMP, a Semiconductor Research Corporation (SRC) program sponsored by DARPA.

Rational Design of BEOL Oxide Semiconductors for Emerging Device Applications.

It is well known that, over a wide range of wavelengths, a graphene sheet absorbs 2.3% of the light passing through it. This value is directly related to the fine structure constant, which can be interpreted by the very particular band structure of this material. Remarkably, it has been shown experimentally that thin InAs films exhibit an aborption spectrum characterized by steps that can also be related to the fine structure constant. We present numerical simulations (TB, KP) showing that this phenomenon is very robust and is obtained for a very large number of semiconductor materials. We complement this work with analytical calculations to understand the physical origin of this behavior. The comparison with graphene is discussed.

Optical absorption quantization in nanolayers of semiconductors

Halide perovskite semiconductors, either fully inorganic or hybrid organic-inorganic, have attracted a lot of interest since 2012 owing to their excellent performances for photovoltaic applications. These low-cost semiconductors have attractive intrinsic physical properties for optoelectronics, including direct band gaps, small effective masses, large carrier mobilities, sizeable optical absorption and quantum yield for luminescence. Available tools, including commercial codes, for semiconductor device simulations provide reasonable descriptions of the perovskite device characteristics under operation. However such simulations are still hardly predictive. The aim of the presentation will be to give an overview of the current challenges for such simulations by comparison to classical semiconductors, including 1) the diversity of compositions, nanostructure dimensionalities, crystallographic structures or processing of the perovskite materials, 2) the unusual physical properties of this new class of soft and ionic semiconductors, 3) the primary importance and complexity of the interfaces in perovskite-based thin film heterostructures

Perovskite semiconductors: current challenges for predictive atomistic and device simulation.

Computer simulations are well established to support experimental R&D in OLED and OPV technology: On the molecular scale, quantum chemistry tools such as DFT are used to compute molecular properties such as HOMO or levels or excitation energies, while continuum models, e.g. drift diffusion, are efficient tools for virtual design on the device level. 
However, the application of quantum chemistry methods is limited to a few molecules at best, prohibiting the direct computation of material properties in thin films and their impact on device performance. Continuum models on the other hand rely on parametric models which often need to be calibrated with experiments due to the lack of predictive microscopic models. 
We bridge this gap of scales using a multiscale workflow that connects fundamental chemistry and device design: Using a physical vapor deposition protocol with customized force-fields and a quantum embedding scheme we generate digital twins of OLED layers and devices. For these digital twins we compute electrical properties such as electron affinity, ionization potential and permittivity. Using a kinetic Monte-Carlo protocol we conduct virtual experiments on the digital twins to simulate charge carrier and exciton dynamics in OLED devices to e.g. compute charge carrier mobility or device efficiency. These microscopic simulations generate a fundamental understanding on how molecular properties trigger and balance microscopic processes, thereby enabling materials and device designers to systematically eliminate bottlenecks in OLED performance. Further, the multiscale workflow can be used to parametrize continuum models from first principles, facilitating full virtual design.

Connecting quantum chemistry and device level simulations via multiscale simulation workflows

This tutorial will focus on how to determine the dielectric, electronic transport, and magnetic properties of two-dimensional (2D) materials from first principles using density functional theory (DFT). We will exhibit a simple yet robust methodology to extract the dielectric constant of a monolayer/few-layer structures from a DFT calculation. We will illustrate the dielectric constant methodology by determining the low- and high-frequency dielectric constant of hexagonal boron-nitride, transition metal dichalcogenides (TMDs), and novel unexplored dielectrics. Next, we will show how our open-source Plane-wave Electron TRAnsport (PETRA) quantum transport code can be used to simulate transport in nanowires and nanoribbons. Finally, we will show how from DFT calculations for various magnetic configurations, the exchange interaction can be described as a function of concentration. Once the exchange interaction description is determined, Monte Carlo simulations can be performed to determine the magnetic order and the Curie/Néel temperature, the magnetic properties of layered materials can be determined. We will illustrate the approach using monolayer MoSe2 and show that five different magnetic orderings in 2D materials are revealed.

Computing Dielectric, Electronic Transport, and Magnetic Properties of Two-Dimensional Materials from First Principles

/Users/paologargini/Documents/MS Office PP/2021/21 EUROPE/2021_-9_06_ESSDERC_IoT/2021_09_06_Paolo_Abstract.pdf

IoT: Promises, Challenges and Solutions

The presentation provides a short introduction to the sustainability issues related to minerals and, mainly, metals needed by the ICT industry. It contextualizes the ICT driven demand in a broader outlook for the coming decades, driven by demography, the rise of the global middle-class, urbanization, and the transition towards a low-carbon global economy.

ICT and mineral raw materials: sustainability issues

Can we cope with the upcoming massive deployment of IoT within environmental limits?

Europe is facing one of the biggest challenges of its history: that of preserving a viable environment for the decades to come. On human consciousness of its environmental impact, Prof Bartlet says “The greatest shortcoming of the human race is our inability to understand the exponential function” [1]. ICT was, and still is, driven by exponential functions (Moore’s law, Ops/ Watt, data exchanges volume worldwide, ...). But each exponential has its sustainability limits which are often reached sooner than expected. In ICT history to date, when those limits are reached, they are overcome by a technology breakthrough. By way of example, there was the CMOS (Complementary Metal-Oxide- Semiconductor) technology, a product of laboratory curiosity of the 1980s when bipolar transistor power consumption was too high. New integrated system (multi-core processor) and device (SOI, FinFET,...) architectures entered the market when energy consumption limits were reached by CPUs; CMOS is still today the much cheaper and reliably power efficient technology for the development and growth of the Internet of Things. Awareness of the rapid proliferation of wirelessly connected objects around us gives rise to questions and fears among the public. There is a need for more transparency on the environmental footprint of ICT and a need to establish an ambitious roadmap, at research and industrial levels, for moving into a virtuous cycle of eco- innovation.

In this presentation, we propose pathways to maintain or even reduce global (exponential) use of energy and materials for ICT.

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